Published on: May 2026
SKILLSWAP – MICRO SKILL EXCHANGE PLATFORM
Boby Thoke Ajay Patidar Sagar Gautam
Shreyas Pagare
Article Status
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Abstract
SkillSwap enables users to create profiles, list offered skills, search for desired skills, and connect with other learners through a secure communication system. The platform integrates features such as user authentication, skill matching, messaging, scheduling, reviews, ratings, and notifications. The system is developed using modern web technologies including HTML, CSS, JavaScript, Java Spring Boot, Hibernate, and MySQL.
The primary objective of the platform is to encourage peer learning, improve networking among students, and make skill development more accessible. The system also provides scalability for future integration of AI-based skill recommendations, multilingual support, and mobile application deployment. SkillSwap promotes collaborative education, reduces dependency on paid courses, and helps students grow through mutual knowledge sharing.
Keywords: Skill Exchange, Collaborative Learning, Student Platform, Web Application, Peer-to-Peer Learning, Skill Sharing, SkillSwap
How to Cite this Paper
Thoke, B., Patidar, A. & Gautam, S. (2026). Skillswap – Micro Skill Exchange Platform. International Journal of Creative and Open Research in Engineering and Management, <i>02</i>(05). https://doi.org/10.55041/ijcope.v2i5.692
Thoke, Boby, et al.. "Skillswap – Micro Skill Exchange Platform." International Journal of Creative and Open Research in Engineering and Management, vol. 02, no. 05, 2026, pp. . doi:https://doi.org/10.55041/ijcope.v2i5.692.
Thoke, Boby,Ajay Patidar, and Sagar Gautam. "Skillswap – Micro Skill Exchange Platform." International Journal of Creative and Open Research in Engineering and Management 02, no. 05 (2026). https://doi.org/https://doi.org/10.55041/ijcope.v2i5.692.
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Ethical Compliance & Review Process
- •All submissions are screened under plagiarism detection.
- •Review follows editorial policy.
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- •Peer Review Type: Double-Blind Peer Review
- •Published on: May 22 2026
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