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International Journal of Creative and Open Research in Engineering and Management

A Peer-Reviewed, Open-Access International Journal Supporting Multidisciplinary Research, Digital Publishing Standards, DOI Registration, and Academic Indexing.
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ISSN: 3108-1754 (Online)
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Volume 02, Issue 6

Published on: June 2026

LITERATURE REVIEW OF SEMICONDUCTOR PHOTO-LITHOGRAPHY DEVELOPMENT AND IT’S HISTORY IN CHIP MANUFACTURING

Utkarsh Pandey Mamta Rani Rakhi Kamra

Maharaja Surajmal Institute of Technology
Fire Station Road Janakpuri New Delhi 110058

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Plagiarism Passed Peer Reviewed Open Access

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Abstract

Advancements in technology with regard to electronics and especially the computing devices has been attributed to the miniaturization and evolution of chipset. Their making involves the process of semiconductor photolithography which in simpler terms means of etching or ‘tattooing’ the chip with necessary circuit patterns and transistor networks. Chronological developments range from the earliest achieved lithography of micrometer dimension scale of semiconductor evolved from physical transistors to the miniaturization of transistor networks on nanometer scales for a small chip in present times.

Keywords—lithography, photolithography, EUVL, DUVL, semiconductors, chips, photomask, photoresist

How to Cite this Paper

Pandey, U., Rani, M. & Kamra, R. (2026). Literature review of Semiconductor photo-lithography development and it’s history in chip manufacturing. International Journal of Creative and Open Research in Engineering and Management, <i>02</i>(6). https://doi.org/10.55041/ijcope.v2i6.043

Pandey, Utkarsh, et al.. "Literature review of Semiconductor photo-lithography development and it’s history in chip manufacturing." International Journal of Creative and Open Research in Engineering and Management, vol. 02, no. 6, 2026, pp. . doi:https://doi.org/10.55041/ijcope.v2i6.043.

Pandey, Utkarsh,Mamta Rani, and Rakhi Kamra. "Literature review of Semiconductor photo-lithography development and it’s history in chip manufacturing." International Journal of Creative and Open Research in Engineering and Management 02, no. 6 (2026). https://doi.org/https://doi.org/10.55041/ijcope.v2i6.043.

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References


  1. Yen, W. Kaiser and A. Suzuki (2026), "Development of Photolithography for Semiconductor Manufacturing – a Review," in IEEE Electron Devices Reviews, doi: 10.1109/EDR.2025.3650514

  2. Aida, “Autobiography of Japanese Semiconductor Development ( in Japanese)”, NHK Press, 1991.

  3. Andrus, “Fabrication of Semiconductor Devices,” USP 3,122,817, filed on August 15, 1957 and granted on March 3 1964

  4. Koana and Z. Wakimoto, Jpn. J. Appl. Phys., 3, pp. 113–120, 1964.

  5. H. Bruning, “Optical lithography 40 years and holding,” Proc. SPIE, 6520, pp. 652004-1– 652004-13, 2007

  6. Moreau, Wayne M. (2012), Semiconductor Lithography: Principles, Practices, and Materials. Springer US.

  7. Geppert, "Semiconductor lithography for the next millennium," in IEEE Spectrum, vol. 33, no. 4, pp. 33-38, April 1996, doi: 10.1109/6.486632

  8. Jaizul-Aziz, Duta. “Principles of Photolithography in Semiconductor Manufacturing,” n.d. 2020

  9. Chandu, Hiranmaye Sarpana. "A survey of semiconductor wafer fabrication technologies: Advances and future trends." Int. J. Res. Anal. Rev 10, no. 04 (2023): 344-349.

  10. Tu, Yuan. Insights Into Semiconductor Technologies: Transistor, Interconnect, Packaging, Lithography and Memory. N.p., Springer Nature Switzerland, 2026.

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  • Published on: Jun 05 2026
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